IC Package Development Engineer

As an IC Package Design Engineer, your task is to optimize the design of an integrated circuit (IC) package to enhance its performance and reliability. You will be working on a project that involves designing a package and simulations/analysis for very high-speed devices with specific requirements.

What you will do

Your assignment consists of the following tasks: 

• Package Selection and Analysis Select an appropriate IC package type based on the given specifications and IC requirements. Perform a comprehensive analysis of the chosen package's electrical characteristics. Identify any limitations or potential issues that may arise during the design process. 
• Electrical Performance Optimization Optimize the electrical performance of the IC package by focusing on signal integrity, power integrity, and electromagnetic compatibility (EMC). Analyze the routing, parasitic effects, and noise issues associated with the package. Propose design modifications or enhancements to improve electrical performance. 
• Design for Manufacturability and Cost Optimization Consider manufacturability and cost optimization aspects of the IC package design. Review the design for compatibility with manufacturing processes, assembly requirements, and materials availability. Suggest design modifications to streamline the manufacturing process while maintaining or reducing overall costs. 
• Documentation and Reporting Produce a comprehensive report summarizing your analysis, design modifications, and optimization recommendations for the IC package. Include detailed diagrams, simulations, calculations, and experimental results where applicable. Clearly communicate the rationale behind your design decisions and their potential impact on the IC's performance and reliability.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

• MSc in the field of electronics & equivalent or at least 5 years of experience in packaging design as well as SIPI analysis 
• Knowledge in Cadence layout tool 
• Knowledge in Ansys tool 
• Knowledge in 2.5D/3D packaging, backend silicon layout (place & route) 
• To be able to communicate in English is a must